熔盐电镀—Ⅱ,钼的电化学成核和长大及其对电镀的影响

Electroplating from Molten Salts Part Ⅱ. Electrochemical Nucleation and Growth of Molybdenum and Their Effects on Electroplating

  • 摘要: 本文主要用恒电势法研究了钼晶核的形成和长大的动力学规律及其对电镀的影响。实验证明,在所选盐系、温度及浓度范围内,阴极反应开始阶段的控制步骤是半球形晶核的形成及其在扩散控制下的长大。适当控制影响这一步骤的因素,可以改善镀层质量。增大超电势将使晶核密度迅速增大,有利于获得结晶细致、光滑致密的镀层。在恒电势下,升高温度将使晶核密度增大,对改善镀层有利;而在恒电流下,升高温度则极化减小,晶核密度变小,对电镀不利。无论在恒电势或恒电流下,增大浓度都会使晶核密度变小,晶粒变粗,对电镀不利。

     

    Abstract: Potentiostatic method is mainly used to study the nucleation and growth of molybdenum and their effects on electroplating. It has been shown that the rate-determining step of cathodic reaction in the initial stage is hemispherical nucleation with diffusion controlled growth and the quality of electroplates can be improved by controlling the factors effecting this step. Increase of applied overpotential results in increase of nucleus density rapidly, which is favourable for getting an electroplate with coherent nature.fine grains and smooth surface. Under constant potential a higher temperature leads to a higher nucleus density, which is in favour of electroplating. Increase in concentration of molybdenum usually leads to decrease of nucleus density whether Constant potential or constant current is kept in the electroplating.

     

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