通过微孔镀金改善晶体管外引线的耐蚀性

Improvement of Corrosion Resistance of Transistor Leads by Compositive Gold Plating

摘要: 本文报导了用于耐蚀用途的微孔镀金的工艺。晶体管外引线的腐蚀断裂是长期未能解决的问题。通过在可伐引线上电镀暗镍——Ni-Al₂O₃复合镀层——酸性脉冲镀金,构成微孔金镀层体系,使腐蚀断裂倾向明显降低。

Abstract: This paper reports the new technology which improves the corrosion resistance of transtor leads by compositive gold plating. A plating system consisting of dark nickel, Ni-Al₂O₃ compositive plating and acidic pulse gold plating is plated on Kovar leads. The porous gold plating system decreases the tendency of corrosion fracture distinctly.