交流阻抗测定化学镀镍的电化学机理

An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements

摘要: 采用交流阻抗技术对化学镀Ni-P合金的沉积过程进行原位测定,所获得的Nyquist阻抗图上出现感抗圈。综合交流抗击以及还原剂浓度影响研究结果,提出一个包括H₂PO₂^-离子表面吸附步骤的化学镀镍电化学机理。

Abstract: The Model 368 system was used to measure the AC impedance of the process of electroless nickel plating. One inductive loop is found at low frequencies. A theoretical model including the step of adsorption of H₂PO₂^- ions is established based on the AC impedance measurements.