电沉积铜镍纳米多层膜的机理

Mechanism of Electeodeposition of Cu/Ni Multilayer Thin Film

  • 摘要: 采用动电位扫描、循环伏安法以及交流阻抗等方法,研究了从柠檬酸盐体系中电沉积铜镍纳米多层膜的电沉积机理。研究结果表明:在研究体系中铜的沉积是扩散控制的电极过程,而镍的沉积则是首先形成类似Ni(OH)ads的吸附中间产物,而后在电极上进一步还原为原子态。

     

    Abstract: The mechanism of electrodeposition of Cu/Ni multilayer thin films from citrate salt electrolyte has been studied by means of potentodynamic sweep, cyclic voltammetry sweep and AC impendence.The results indicated that the copper deposition is mass transfer controlled process and nickel deposition is related to the absorbed intermediate species such as Ni(OH)ads. The nickel ions first form Ni(OH)ads,then was deoxygenated to nickel on the electrode surface.

     

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