CSP工艺衔接区温度行为分析

Analyses on the Performance of Temperature in the Linking Region of CSP Technology

  • 摘要: 分析了CSP工艺衔接区温度的行为.首先分析坯料在入炉前的温度,指出此区域内影响坯料温度的因素、温度变化状况和冷却特点:其次研究了加热段的加热行为、加热特点、模型选择和保温要求;最后提出CSP衔接区坯料的冷却方式,并给出相应模型.

     

    Abstract: The performance of temperature is analyzed in the linking region of CSP technology. Firstly, analyses are done on the temperature of the slabs before being charged. pointing out the influence factors, the changing status and the cooling features of the temperature of the slabs in this region. Secondly, researches of the heating of the slabs are done especially on the heating behavior, the heating characteristics, the selecting of models and the requirement on temperature reservation in the heating stage. Finally, the cooling pattern of the slabs in the linking region of CSP is put forward, and the corresponding model presented.

     

/

返回文章
返回