Si/(Ni-Cr合金)/Cu扩散偶950℃相稳定性

Phase stability of Si/(Cr-Ni alloy)/Cu couples at 950 ℃

  • 摘要: 在半导体硅片(Si)-扩散阻挡层(Ni-Cr合金)-金属互连材料(Cu)构成的体系中,Si和Ni-Cr合金之间以及Ni-Cr合金和Cu之间各构成一对扩散偶.通过制备扩散偶试样模拟相应的界面反应,实验测定950℃下界面反应产物的表观序列.从热力学的角度,分别对Cr-Ni-Si和Cr-Cu-Ni三元系中Si/(Ni-Cr)和(Ni-Cr)/Cu两个界面进行反应驱动力分析.计算获得的阶段性生成相表观序列与实验测得结果一致.

     

    Abstract: In a system consisted of semiconductor silicon wafer (Si), diffusion resistant layer (Cr-Ni alloy) and metal contact material (Cu), diffusion couples were formed at Si/(Cr-Ni) and (Cr-Ni)/Cu, respectively. The phases formed due to interracial reactions in both the diffusion couples were investigated experimentally and the apparent phase contact sequences were obtained at 950℃. Based on phase equilibrium calculations of the Cr-Cu-Ni and the Cr-Ni-Si ternary systems, the phase formation driving forces for interfacial reactions of the diffusion couples were analyzed theoretically. The step-by-step phase formation sequences were obtained to simulate microstructure evolutions in the diffusion couples. The thermodynamic predictions are in accord with the experimental observations.

     

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