SnAgNi钎料钎焊Ni镀层SiCp/Al复合材料的接头微观结构及剪切性能

Microstructure and shear strength of solder joints of SiCp/Al composites with Ni plating with Sn-2.5Ag-2.0Ni solder

    摘要
  • 摘要: 采用Sn-2.5Ag-2.0Ni焊料钎焊了具有Ni(P)/Ni(B)和Ni(P)/Ni两种双镀层结构的SiCp/Al复合材料.结果表明,SnAgNi/Ni(B)/Ni(P)和SnAgNi/Ni/Ni(P)两种接头均生成唯一的金属间化合物Ni3Sn4.SnAgNi焊料与Ni(B)镀层之间的快速反应速度使Ni3Sn4金属间化合物具有高的生长速度.时效初期的SnAgNi/Ni/Ni(P)接头的剪切强度高于SnAgNi/Ni(B)/Ni(P)接头,但在250h时效后其剪切强度剧烈下降,低于SnAgNi/Ni(B)/Ni(P)接头.金属间化合物的生长及裂纹的形成是SnAgNi/Ni/Ni(P)接头失效的主要原因,而SnAgNi/Ni(B)/Ni(P)接头失效的主要原因是Ni(P)镀层中Ni原子的定向扩散使SiCp/Al复合材料与Ni(P)处产生孔洞.

     

    Abstract: An experimental study was presented to evaluate the microstructures and reliability of solder joints between Sn-2.5Ag2.0Ni solder and various Ni plating layers. Ni(P)/Ni(B) and Ni(P)/Ni double layers were used to deposit on SiCp/Al composites. The high reaction rate between Ni(B) layer and SnAgNi solder leaded to the highest growth rate of intermetallic compound (IMC) Ni3Sn4. The shear strength of solder joints with Ni(P)/Ni layer is higher than that of solder joints with Ni(P)/Ni(B) layer at the initial stage of aging, but lower than that after 250 h aging.Intermetallic layer growth and crack formation are the major reasons of failure for a SnAgNi/Ni/Ni(P) solder joint. While the failure of a SnAgNi/Ni(B)/Ni(P) solder joint is caused by the formation of holes between Ni(P) and SiCp/Al composites, which result from directional diffusion of Ni toward solder.

     

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