(SiC)TiN/Cu复合材料的显微组织和导电性能
Microstructure and electric conductivity of(SiC)TiN/Cu composites
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摘要: 以醇盐水解-氨气氮化法在SiC颗粒表面包覆TiN,然后采用放电等离子体烧结制备出(SiC)TiN/Cu复合材料.结果表明:醇盐水解-氨气氮化法能够制备出TiN包覆SiC复合粉末,TiN包覆层均匀连续,TiN颗粒的粒径为30~80nm.TiN包覆层能够促进复合材料的致密化并改善界面结合.(SiC)TiN/Cu复合材料的电导率介于15.5~35.7 m·Ω-1·mm-2之间,并且随着SiC体积分数的增加而降低.TiN包覆层和基体中网络结构TiN的存在能够有效提高复合材料的电导率.复合材料的电导率较接近P.G模型的预测值.Abstract: TiN-coated SiC particles were prepared by the combination of alkoxide-hydrolysis and ammonia-nitridation. The coated composite powder was consolidated by spark plasma sintering. The results indicate that alkoxide-hydrolysis in combination with ammonia-nitridation is a suitable technique to produce TiN-coated SiC particles. The TiN film is thin and continuous, and the TiN particle size is about 30 to 80 nm, which is favorable to improve the densification and enhance interfacial bonding between the reinforcement and the matrix. The electric conductivity of (SiC) TiN/Cu composites is in the range of 15.5 to 35.7 m·Ω-1·mm-2 and decreases with increasing SiC content. The TiN film and the formation of a TiN network in the matrix contribute to the enhancement of electric conductivity. Additionally, the electric conductivity of the composites is more close to data predicted by the P. G model.