分形微通道换热过程强化研究进展

Research progress on fractal microchannels for heat transfer process intensification

  • 摘要: 随着微纳制造技术的快速发展,微电子芯片、微反应器和微燃料电池等微型器件受到了研究者越来越多的关注。微型器件的应用不仅对加工工艺和材料具有较高的要求,而且需要高效的热管理来维持其性能。特别是对于高集成度和高频化的高性能微电子芯片而言,超高的热流密度不仅会严重制约芯片的性能,而且会显著影响芯片的寿命和可靠性。鉴于传统的风冷和液体单相对流换热冷却方式无法满足散热需求,具有高换热系数的微通道换热技术成为解决微型器件散热问题的重要途径。然而,常规的微通道换热技术普遍存在着高流动阻力和非均温性的难题,限制了该技术的实际规模化应用。近年来,研究者开发出一系列新型的分形微通道技术用于换热过程强化。本文系统总结了不同类型的分形换热微通道(包括Y、H、T、Ψ、康托、科赫等分形结构),并对各分形微通道的原理和性能进行了着重介绍,最后对分形微通道换热的现存挑战和未来发展方向分别进行了分析和展望,以期为换热过程强化的发展提供新的研究思路。

     

    Abstract: With the rapid development of microscale/nanoscale manufacturing technology, electronic microchips, microreactors, and microscale fuel cells have attracted considerable attention. The practical applications of miniaturized devices require not only advanced fabrication procedures and materials but also efficient thermal management to maintain their performance. For electronic microchips with high integration and frequency, high heat flux not only significantly limits their performance but also considerably affects their lifetime and reliability. Given that conventional air cooling and single-phase liquid convection cooling methods cannot meet the heat dissipation requirements, microchannel heat transfer technology has become an important alternative to solve the heat transfer problem of miniaturized devices. However, conventional microchannel heat transfer methods usually face two major challenges, namely, microscale dimensions that result in high-pressure drop and high-pump power consumption and temperature increase along the microchannels that considerably affect stability and reliability. The resulting high flow resistance and temperature nonuniformity significantly limit the practical applications of microchannel heat sinks. In recent years, inspired by natural fractals, such as mountain ranges, rivers, leaf venations, plant roots, tree trunks, blood vessels, and lung bronchus, researchers have developed a series of new types of fractal microchannels for heat transfer process intensification. This review provides a comprehensive overview of state-of-the-art research on fractal microchannel heat sinks, such as Y-shaped, H-shaped, T-shaped, Ψ-shaped, Cantor, and Koch fractals. We highlight the principles of heat transfer fractal microchannels, discuss the theoretical and experimental research findings, and identify the current problems and future research directions. Although research on fractal heat sinks has already gained considerable progress, the following challenges should be carefully considered: most studies focus on numerical simulations; meanwhile, experimental studies are relatively limited because of the difficulties in device fabrication. Compared with Y-shaped fractals, the other types of fractal microchannels exhibited a better performance but have received significantly less attention. Both multilayer and hydrogel-assisted fractal microchannels have typically high heat transfer capacity; however, their fabrication process is complicated. There are still a few contradictory results concerning the impact of fractal structures on heat transfer enhancement that need in-depth theoretical modeling and experimental observations. This review can not only provide an in-depth understanding of fractal microchannels but also shed new light on the development of robust fractal heat sinks for intensifying heat transfer applications.

     

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