Hu Maopu, Luan Benli. An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements[J]. Chinese Journal of Engineering, 1991, 13(2): 162-168. DOI: 10.13374/j.issn1001-053x.1991.02.012
Citation:
Hu Maopu, Luan Benli. An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements[J]. Chinese Journal of Engineering, 1991, 13(2): 162-168. DOI: 10.13374/j.issn1001-053x.1991.02.012
Hu Maopu, Luan Benli. An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements[J]. Chinese Journal of Engineering, 1991, 13(2): 162-168. DOI: 10.13374/j.issn1001-053x.1991.02.012
Citation:
Hu Maopu, Luan Benli. An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements[J]. Chinese Journal of Engineering, 1991, 13(2): 162-168. DOI: 10.13374/j.issn1001-053x.1991.02.012
An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements
The Model 368 system was used to measure the AC impedance of the process of electroless nickel plating. One inductive loop is found at low frequencies. A theoretical model including the step of adsorption of H2PO2- ions is established based on the AC impedance measurements.